CLB-025025-DualLaser CO2 Laser Drilling / Cutting Workstation



















APPLICATIONS  -  CERAMIC

TECHNICAL CERAMICS SUCH AS ALUMINA (AL2O3) ARE TRADITIONALLY QUITE DIFFICULT TO MACHINE, DUE TO THEIR BRITTLENESS AND HARDNESS. 

CO2 laser processing reduces mechanical stress, allowing lines, slots, holes and other features to be machined. The laser's pulse regime is critical when processing ceramic, so the capability of Luxinar SR 15i to deliver long pulses up to 1 millisecond is a distinct advantage in these applications.



Alumina cutting & drilling

Technical ceramics are widely used in the microelectronics industry, and are traditionally difficult to machine. These materials are hard and brittle, and components are generally small. Laser processing allows lines, slots, holes and complex profiles to be machined with no tool contact and reduced mechanical stress.
 

The laser process requires very careful control of the parameters; the Luxinar SR 15i is designed with ceramic processing in mind, allowing control of the pulse width from 2µs to 1ms. The pulse regime of the laser is critical; long pulses and slow process speeds usually produce superior results.

Alumina (Al2O3) is the most common material, but we can also process other ceramics, including zirconia, aluminium nitride and boron nitride.

Alumina scribing

Ceramic components can be separated by drilling a series of closely spaced blind holes along the required cutting line. The ceramic is then broken cleanly along this line. In many cases this “scribe and break” technique is faster and more reliable than full cutting. The hole depth and separation must be precisely controlled in order to ensure a clean break. The Luxinar SR 15i is particularly well suited to this application, offering pulse widths up to 1 millisecond for complete control of the scribing depth.








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