ATPSB-030030 - 2 in1 (Fiber + CO2) Laser Patterning System

Working Area : 030cm X 030cm ; 
Scan Len #1 for Fiber Laser : Marking Field : 110mm X 110mm ;
Scan Len #2 for CO2 Laser : Marking Field : 140mm X 140mm

100 W Pulse Fiber Laser + 150 W Pulse CO2 Laser  Inside   
   
































1. Laser Drilling


Laser drilling has become a widely used manufacturing solution in many industries. The primary advantage of laser drilling is that it is a non-contact process and hence mechanical wear of the drilling tool is not an issue. Other benefits include the flexibility to drill almost any material, the ability to change hole size, shape and approach angle instantaneously, the low heat input to the parent material and excellent hole-to-hole dimensional repeatability. In addition, the laser has the ability to drill small diameters not possible with conventional drilling techniques. Holes in the 10 micron region are possible with fiber laser technology.


The common techniques used in drilling are percussion hole drilling and trepanning. Percussion drilling is a process where multiple pulses are applied per hole to achieve the desired results. On-the-fly drilling is a sub-set of percussion drilling where the target surface moves at high speed with respect to the laser beam and the laser is continuously pulses to produce holes. Trepanning is a process that allows cutting of large diameter holes or contoured shapes. Hole taper can be carefully controlled in the trepanning process. Lasers can rapidly switch from trepanned hole drilling to percussion drilling on-the-fly to produce a wide range of hole sizes in one part.


The advantages of laser drilling have been accepted many years ago by the aerospace industry. Today, quasi-continuous wave (QCW) fiber lasers are rapidly superseding older flashlamp pumped technology for drilling large holes (0.2 - 1 mm). This type of hole can be made in a wide variety of aerospace components such as nozzle guide vanes, blades and cooling rings and combustors. QCW fiber lasers have a unique combination of high peak power and high pulse energy making them ideal for applications requiring multi-joule pulses in the millisecond regime. The flexible QCW laser can also be rapidly reconfigured for CW operation for cutting larger details.


The microelectronics industry has employed laser drilling for a wide range of applications such as drilling alumina ceramic substrates. Drilling of small holes with diameter less than 10 μm is required at very high speeds, up to several thousands of holes per second. In this case, high peak power q-switched type fiber lasers or shorter variable pulsed fiber lasers are employed with pulse repetition rates up to 1 MHz and pulse lengths as short as 1.5 ns.


High power fiber lasers are also currently used for rock drilling applications and for oil and gas exploration industries. The high peak powers and energy pulses are also used for drilling thick metals.


Types of Metals : Stainless Steels / Carbon Steels / Gold & Silver / Aluminum / Tool Steels / Nickel Alloys / Brass & Copper / Titanium









1.1 Metal Microdrilling with nanosecond pulsed fiber laser

1.2 Rapid Cutting Metal Foils with single mode 1000W Fiber Laser




1.3 Ceramic Drilling with Fiber Laser

APPLICATIONS  -  CERAMIC
 

TECHNICAL CERAMICS SUCH AS ALUMINA (AL2O3) ARE TRADITIONALLY QUITE DIFFICULT TO MACHINE, DUE TO THEIR BRITTLENESS AND HARDNESS. 

CO2 laser processing reduces mechanical stress, allowing lines, slots, holes and other features to be machined. The laser's pulse regime is critical when processing ceramic, so the capability of Luxinar SR 15i to deliver long pulses up to 1 millisecond is a distinct advantage in these applications.


Alumina cutting & drilling

Technical ceramics are widely used in the microelectronics industry, and are traditionally difficult to machine. These materials are hard and brittle, and components are generally small. Laser processing allows lines, slots, holes and complex profiles to be machined with no tool contact and reduced mechanical stress.

The laser process requires very careful control of the parameters; the Luxinar SR 15i is designed with ceramic processing in mind, allowing control of the pulse width from 2µs to 1ms. The pulse regime of the laser is critical; long pulses and slow process speeds usually produce superior results.

Alumina (Al2O3) is the most common material, but we can also process other ceramics, including zirconia, aluminium nitride and boron nitride.

Alumina scribing

Ceramic components can be separated by drilling a series of closely spaced blind holes along the required cutting line. The ceramic is then broken cleanly along this line. In many cases this “scribe and break” technique is faster and more reliable than full cutting. The hole depth and separation must be precisely controlled in order to ensure a clean break. The Luxinar SR 15i is particularly well suited to this application, offering pulse widths up to 1 millisecond for complete control of the scribing depth.





2. Deep Engraving and Marking

The good absorption properties of most metals at near IR wavelengths make fiber lasers very attractive for laser marking applications. The beam quality, compact design and maintenance-free operation of Q-switched type and CW lasers are designed for a wide range of applications and fit most marking requirements.

Q-switched type fiber lasers with pulse energy up to 10 mJ and average powers up to 200 W provide the high peak powers and nanosecond pulses that can be used to mark most materials. The high peak power enables marking of reflective materials such as gold and aluminum. Examples include deep permanent markings on heavy-duty gears and auto parts.

The CW single-mode fiber lasers accommodate some marking requirements in metals. The CW output is important when fast, clean and shallow non-intrusive markings are required.











3. Surface Cleaning and Structuring


Laser coating removal is an ablative process whereby laser energy is focused and absorbed by the surface, resulting in vaporization of the coating with minimal effect to the underlying substrate. This process can be applied to various materials including metal, plastics, composites and glass.

Several new grades of press-hardened steels (PHS) have been developed for the body-in-white (BIW) structure in the automotive industry that combine desirable properties of strength and formability. Prior to assembling PHS components, the aluminum silicon coating must be removed to allow better weld surface capabilities. IPG’s high power pulsed lasers successfully remove the coating without affecting the mechanical properties produced by the weld bond.

Coating removal applications are also used in heavy industries such as aerospace and ship building for their cost-effective and environmental-friendly alternative to conventional abrasive and chemical processes. Because lasers operate as a non-contact surface removal application, there is no need for a secondary medium that contributes to waste streams.




























3.1 Cleaning and Welding preparation


3.2 Laser Cleaning with 1kW Pulse Fiber Laser -1


3.3 Rust Laser Cleaning


3.4 Paint Revoval fron Steel with YLPN-100-25x100-1000-S -01


3.5 Texturing Aluminum with YLPN-100-25x100-1000-S


3.6 Cleaning Rust from Carbon Steel -1


3.7 Cleaning Rust from Carbon Steel -2


4. Cutting Plastic Films and Removal of Coating from Film (or Glass)
 

 via following link to get the catalog:

ATPSB-030030-2in1-150Pand100F-2022-0511.pdf